- All sections
- B - Performing operations; transporting
- B26F - Perforating; punching; cutting-out; stamping-out; severing by means other than cutting
- B26F 1/40 - Cutting-out; Stamping-out using a press, e.g. of the ram type
Patent holdings for IPC class B26F 1/40
Total number of patents in this class: 252
10-year publication summary
|
24
|
18
|
30
|
23
|
33
|
19
|
26
|
23
|
21
|
7
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Bobst Mex SA | 542 |
14 |
| Koenig & Bauer AG | 958 |
6 |
| Tetra Laval Holdings & Finance S.A. | 2007 |
6 |
| Nitto Denko Corporation | 7879 |
4 |
| Berhalter AG | 12 |
4 |
| Phoenix Partners, LLC | 8 |
4 |
| Takahashi Keisei Corporation | 13 |
4 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
3 |
| Blanking Systems, Inc. | 70 |
3 |
| Dicar, Inc. | 26 |
3 |
| Groz-Beckert KG | 393 |
3 |
| I.M.A. Industria Macchine Automatiche S.p.A. | 424 |
3 |
| Nanoprecision Products, Inc. | 30 |
3 |
| Sarong S.p.A. | 142 |
3 |
| United States Gypsum Company | 1019 |
3 |
| VMI Holland B.V. | 346 |
3 |
| Finetech. Co., Ltd. | 20 |
3 |
| Yancheng Huasen Machinery Co., Ltd. | 18 |
3 |
| Honda Motor Co., Ltd. | 24537 |
2 |
| LG Electronics Inc. | 69257 |
2 |
| Other owners | 173 |